- Patent Title: Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board
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Application No.: US17505950Application Date: 2021-10-20
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Publication No.: US12144120B2Publication Date: 2024-11-12
- Inventor: Ryohei Kasai , Tadashi Furukawa , Ryo Furugen , Teppei Sotoda , Tetsushi Hosoda , Ayako Furuse
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo-to
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo-to
- Agency: Oliff PLC
- Priority: JP2015-191214 20150929,JP2015-238262 20151207,JP2015-238263 20151207,JP2016-081395 20160414,JP2016-138198 20160713,JP2016-138199 20160713,JP2016-182064 20160916
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H01L21/48 ; H01L21/768 ; H01L23/498 ; H01L23/544 ; H01L21/56
Abstract:
A mold includes a mold base material and a rugged structure located at a main surface of the mold base material. The rugged structure includes a plurality of linearly shaped projected portions for forming wiring, and a circularly shaped projected portion for forming a pad portion, in which a light-shielding layer is provided at a top portion flat surface of the circularly shaped projected portion for forming the pad portion.
Public/Granted literature
- US2662451A Forming roll Public/Granted day:1953-12-15
Information query
