Invention Grant
- Patent Title: Method of manufacturing printed circuit board
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Application No.: US17998966Application Date: 2021-11-16
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Publication No.: US12144122B2Publication Date: 2024-11-12
- Inventor: Shoichiro Sakai , Ryuta Ohsuka , Koji Nitta , Yoshihito Yamaguchi , Masaharu Yasuda , Akira Tsuchiko , Koji Kasuya , Kenji Nishie , Yu Fukui
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , MEC COMPANY LTD.
- Applicant Address: JP Osaka; JP Shiga; JP Hyogo
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.,SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.,MEC COMPANY LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.,SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.,MEC COMPANY LTD.
- Current Assignee Address: JP Osaka; JP Shiga; JP Hyogo
- Agency: IPUSA, PLLC
- Priority: JP2020-194324 20201124
- International Application: PCT/JP2021/042117 WO 20211116
- International Announcement: WO2022/113831 WO 20220602
- Main IPC: H05K1/03
- IPC: H05K1/03 ; C22C19/05 ; H05K3/10 ; H05K3/12

Abstract:
In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.
Public/Granted literature
- US20230232540A1 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD Public/Granted day:2023-07-20
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