Invention Grant
- Patent Title: Heat dissipating device
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Application No.: US17975511Application Date: 2022-10-27
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Publication No.: US12144150B2Publication Date: 2024-11-12
- Inventor: Xiao-Yao Li , Yu-Ka Feng , Yuan-Long Wen
- Applicant: VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
- Applicant Address: CN Hui Zhou
- Assignee: VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
- Current Assignee: VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
- Current Assignee Address: CN Hui Zhou
- Agency: Hershkovitz & Associates, PLLC
- Agent Abe Hershkovitz
- Priority: CN202210921448.1 20220802
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Provided is a heat pipe, which has a simple construction but an excellent heat transfer performance. A loop-type heat pipe (1) has a loop-shaped fluid moving route, in which an evaporation portion (2), a vapor-rich pipe portion (4), a condensation portion (3) and a liquid-rich pipe portion (5) are sequentially connected. A nozzle portion (6) and a diffuser portion (7) are formed in that loop-shaped fluid moving route. As a result, a difference is made between the forward fluid resistance and the backward fluid resistance of the loop-shaped fluid moving route, thereby to form a one-directional steam flow in the loop-shaped fluid moving route.
Public/Granted literature
- US20240049428A1 HEAT DISSIPATING DEVICE Public/Granted day:2024-02-08
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