Invention Grant
- Patent Title: Semiconductor device including select cutting structure, method for manufacturing the same and electronic system including the same
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Application No.: US17557642Application Date: 2021-12-21
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Publication No.: US12144171B2Publication Date: 2024-11-12
- Inventor: Choasub Kim , Dongmin Kyeon , Hayan Park , Youngsun Cho , Changhyun Hur
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2021-0072087 20210603
- Main IPC: H10B41/41
- IPC: H10B41/41 ; H01L23/528 ; H10B41/10 ; H10B41/27 ; H10B41/35 ; H10B43/10 ; H10B43/27 ; H10B43/35 ; H10B43/40

Abstract:
A semiconductor device of the disclosure includes a peripheral circuit structure including a peripheral transistor, a semiconductor layer on the peripheral circuit structure, a source structure on the semiconductor layer, a gate stack structure on the source structure, the gate stack structure including a word line, a gate upper line and a staircase structure, a memory channel structure and a dummy channel structure extending through the gate stack structure, a cut structure extending through the gate upper line, and a bit line overlapping with the memory channel structure. The cut structure includes a narrow section, and a wide section nearer to the staircase structure than the narrow section. A width of the narrow section is less than a width of the wide section.
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