Invention Grant
- Patent Title: Substrate for flexible device
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Application No.: US17274030Application Date: 2019-08-29
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Publication No.: US12144239B2Publication Date: 2024-11-12
- Inventor: Kouji Nanbu , Toshihiko Miyazaki , Hirohisa Masuda , Hiroshi Shimomura
- Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Applicant Address: JP Tokyo
- Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2018-170589 20180912
- International Application: PCT/JP2019/033852 WO 20190829
- International Announcement: WO2020/054441 WO 20200319
- Main IPC: H01L51/00
- IPC: H01L51/00 ; C03C3/066 ; C03C3/12 ; C03C3/14 ; C03C8/04 ; C03C8/16 ; C23C8/14 ; C23C24/08 ; C23C26/00 ; C23C28/00 ; C23C28/04 ; C23D5/00 ; G09F9/30 ; H10K77/10 ; H10K102/00
Abstract:
A substrate for flexible device, including a stainless steel sheet, an oxide layer formed on a surface of the stainless steel sheet, and a glass layer of electrically-insulating bismuth-based glass formed in a form of layer on the surface of the oxide layer. Also disclosed is a sheet for flexible device, including a stainless steel sheet, and an oxide layer on a surface of the stainless steel sheet, the oxide layer having a thickness of not less than 30 nm.
Public/Granted literature
- US20210343953A1 SUBSTRATE FOR FLEXIBLE DEVICE Public/Granted day:2021-11-04
Information query
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