Invention Grant
- Patent Title: Semiconductor structure and method of manufacture
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Application No.: US17671731Application Date: 2022-02-15
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Publication No.: US12144268B2Publication Date: 2024-11-12
- Inventor: Kerem Akarvardar , Yu Chao Lin , Wei-Sheng Yun , Shao-Ming Yu , Tzu-Chiang Chen , Tung Ying Lee
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H10N70/00
- IPC: H10N70/00 ; H10N70/20

Abstract:
A semiconductor structure includes a first dielectric layer, an electrode in the first dielectric layer, a second dielectric layer in the electrode, and a phase change material over the first dielectric layer, the electrode, and the second dielectric layer. According to some embodiments, an uppermost surface of the electrode is at least one of above an uppermost surface of the first dielectric layer, above an uppermost surface of the second dielectric layer, or above a lowermost surface of the phase change material.
Public/Granted literature
- US20230263081A1 SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE Public/Granted day:2023-08-17
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