Invention Grant
- Patent Title: High-density and high-voltage-tolerable pure core memory cell
-
Application No.: US17587242Application Date: 2022-01-28
-
Publication No.: US12148487B2Publication Date: 2024-11-19
- Inventor: Ku-Feng Lin , Perng-Fei Yuh , Meng-Sheng Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: FOLEY & LARDNER LLP
- Main IPC: G11C17/16
- IPC: G11C17/16

Abstract:
In some aspects of the present disclosure, a memory circuit is disclosed. In some aspects, the memory circuit includes a first storage element coupled to a first bit line, a first transistor coupled between the first storage element and a center node, a second storage element coupled to a second bit line, a second transistor coupled between the second storage element and the center node, and a third transistor coupled between the center node and a reference node.
Public/Granted literature
- US20230037696A1 HIGH-DENSITY & HIGH-VOLTAGE-TOLERABLE PURE CORE MEMORY CELL Public/Granted day:2023-02-09
Information query