Invention Grant
- Patent Title: Multilayer ceramic electronic component with a stress applied Ni plated layer
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Application No.: US17967929Application Date: 2022-10-18
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Publication No.: US12148573B2Publication Date: 2024-11-19
- Inventor: Shima Katsube , Yasuhiro Mishima , Yoshiyuki Nomura , Kazuki Yoshino
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JP2021-174844 20211026
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30

Abstract:
A multilayer ceramic capacitor includes a multilayer body including ceramic layers and internal electrode layers laminated therein, a pair of external electrodes electrically connected to the internal electrode layers and provided on two end surfaces of the multilayer body. The pair of external electrodes each include a base electrode layer including a metal component, an electrically conductive resin layer on the base electrode layer and including a thermosetting resin and a metal component, and a Ni-plated layer on the electrically conductive layer. A stress of about −150 MPa or more and about 50 MPa or less is applied to the Ni-plated layer, and an end portion of the Ni-plated layer being in contact with the multilayer body.
Public/Granted literature
- US20230126382A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2023-04-27
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