Invention Grant
- Patent Title: Substrate support
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Application No.: US17204666Application Date: 2021-03-17
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Publication No.: US12148636B2Publication Date: 2024-11-19
- Inventor: Masanori Takahashi , Shota Ezaki
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP2020-065964 20200401
- Main IPC: H01L21/67
- IPC: H01L21/67 ; F25B21/04 ; H01J37/32 ; H01L21/683
Abstract:
A substrate support for use in a substrate processing apparatus includes: a base having an internal space; an electronic circuit board disposed in the internal space; a substrate supporting plate disposed on the base; and at least one temperature adjusting element disposed in the internal space, the at least one temperature adjusting element being configured to adjust a temperature of the electronic circuit board.
Public/Granted literature
- US20210313202A1 SUBSTRATE SUPPORT Public/Granted day:2021-10-07
Information query
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