Invention Grant
- Patent Title: Memory device and method of manufacturing the same
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Application No.: US17468344Application Date: 2021-09-07
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Publication No.: US12148709B2Publication Date: 2024-11-19
- Inventor: Yoo Hyun Noh
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: WILLIAM PARK & ASSOCIATES LTD.
- Priority: KR10-2021-0028918 20210304
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H10B43/10 ; H10B43/27 ; H10B43/35

Abstract:
The present technology relates to a memory device and a method of manufacturing the same. A memory device according to an embodiment of the present disclosure includes a main chip region, a chip guard region disposed adjacent to the main chip region, a plurality of chip guard patterns formed in the chip guard region, and a buffer slit formed in a space between the plurality of chip guard patterns.
Public/Granted literature
- US20220285285A1 MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-09-08
Information query
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