Invention Grant
- Patent Title: Integrated circuit structure of group III nitride semiconductor, manufacturing method thereof, and use thereof
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Application No.: US17436011Application Date: 2021-03-03
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Publication No.: US12148822B2Publication Date: 2024-11-19
- Inventor: Zilan Li
- Applicant: GUANGDONG ZHINENG TECHNOLOGY CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: GUANGDONG ZHINENG TECHNOLOGY CO., LTD.
- Current Assignee: GUANGDONG ZHINENG TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Casimir Jones, S.C.
- Agent Robert A. Goetz
- Priority: CN202010361160.4 20200429
- International Application: PCT/CN2021/078955 WO 20210303
- International Announcement: WO2021/218371 WO 20211104
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/8252 ; H01L27/098 ; H01L29/66

Abstract:
The present disclosure provides an integrated circuit structure of a group III nitride semiconductor, a manufacturing method thereof, and use thereof. The integrated circuit structure is a complementary circuit of HEMT and HHMT based on the group III nitride semiconductor, and can realize the integration of HEMT and HHMT on the same substrate, and the HEMT and the HHMT respectively have a polarized junction with a vertical interface, the crystal orientations of the polarized junctions of the HEMT and the HHMT are different, the two-dimensional carrier gas forms a carrier channel in a direction parallel to the polarized junction, and corresponding channel carriers are almost depleted by burying the doped region.
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