Invention Grant
- Patent Title: Electronic device including shielding member and heat radiating structure
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Application No.: US17945584Application Date: 2022-09-15
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Publication No.: US12150238B2Publication Date: 2024-11-19
- Inventor: Wansang Ryu
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2021-0142975 20211025
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H04N23/51
Abstract:
An electronic device is provided. The electronic device includes a housing, a printed circuit board disposed in the housing, a first electronic component and/or a second electronic component disposed on the printed circuit board, a shielding member disposed to surround the first electronic component and/or the second electronic component, and a first thermal diffusion member configured to surround at least a portion of a first surface of the shielding member.
Public/Granted literature
- US20230127318A1 ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER AND HEAT RADIATING STRUCTURE Public/Granted day:2023-04-27
Information query
