Invention Grant
- Patent Title: Method of forming a laminate structure having a plated through-hole using a removable cover layer
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Application No.: US17001431Application Date: 2020-08-24
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Publication No.: US12150254B2Publication Date: 2024-11-19
- Inventor: Shinichi Iketani , Dale Kersten
- Applicant: Sanmina Corporation
- Applicant Address: US CA San Jose
- Assignee: Sanmina Corporation
- Current Assignee: Sanmina Corporation
- Current Assignee Address: US CA San Jose
- Agency: LOZA & LOZA, LLP
- Agent Tyler Barrett
- Main IPC: H05K3/42
- IPC: H05K3/42
Abstract:
A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.
Public/Granted literature
- US20210014980A1 METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE USING A REMOVABLE COVER LAYER Public/Granted day:2021-01-14
Information query
