Invention Grant
- Patent Title: Display panel motherboard and method for manufacturing a display panel
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Application No.: US17624037Application Date: 2021-12-22
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Publication No.: US12150328B2Publication Date: 2024-11-19
- Inventor: Jiajia Qian
- Applicant: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicant Address: CN Guangdong
- Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Current Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Current Assignee Address: CN Guangdong
- Agent Rivka Friedman
- Priority: CN202111546613.1 20211216
- International Application: PCT/CN2021/140614 WO 20211222
- International Announcement: WO2023/108772 WO 20230622
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; H10K50/84 ; H10K59/80 ; H10K71/00

Abstract:
An embodiment of the application discloses a display panel motherboard and a method for manufacturing a display panel. The display panel motherboard includes a plurality of panel areas and a cutting area located between the panel areas. The display panel motherboard further includes a substrate, a display function layer, a peeling film layer, and an encapsulation layer. In particular, the display function layer is disposed on the substrate and includes a plurality of display unit sections, of which one display unit section is formed within one panel area. The peeling film layer is located within the cutting area. The encapsulation layer can be patterned as a consequence of peeling off the pre-formed peeling film layer without a photomask.
Public/Granted literature
- US20230200109A1 DISPLAY PANEL MOTHERBOARD AND METHOD FOR MANUFACTURING A DISPLAY PANEL Public/Granted day:2023-06-22
Information query
IPC分类: