Invention Grant
- Patent Title: Liquid ejection head
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Application No.: US18364234Application Date: 2023-08-02
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Publication No.: US12151479B2Publication Date: 2024-11-26
- Inventor: Hiroshi Higuchi
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP2021-030364 20210226
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14

Abstract:
A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.
Public/Granted literature
- US20230373215A1 LIQUID EJECTION HEAD Public/Granted day:2023-11-23
Information query
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