Invention Grant
- Patent Title: Heat transfer control structure, flying object and spacecraft with high heat resistance
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Application No.: US17324497Application Date: 2021-05-19
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Publication No.: US12151832B2Publication Date: 2024-11-26
- Inventor: Kenta Katsunaga , Tadashi Inagaki
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: HAUPTMAN HAM, LLP
- Priority: JP2020-090904 20200525
- Main IPC: B64G1/58
- IPC: B64G1/58 ; B64G1/64 ; F16L59/12

Abstract:
A heat transfer control structure includes: an outer shell having an outer surface and an inner surface, the outer shell being heated by airflow along the outer surface; an inner shell disposed opposed to the inner surface of the outer shell, the inner shell being configured to accommodate a payload therein; and a plate coupled to the inner shell such that the plate is opposed to the inner shell across a gap. The outer shell is coupled to the plate.
Public/Granted literature
- US20210362884A1 HEAT TRANSFER CONTROL STRUCTURE, FLYING OBJECT AND SPACECRAFT WITH HIGH HEAT RESISTANCE Public/Granted day:2021-11-25
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