Invention Grant
- Patent Title: Automated semiconductor substrate polishing and cleaning
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Application No.: US16947157Application Date: 2020-07-21
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Publication No.: US12154810B2Publication Date: 2024-11-26
- Inventor: ShinBae Park , SangJun Kim
- Applicant: GlobalWafers Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: GlobalWafers Co., Ltd.
- Current Assignee: GlobalWafers Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Armstrong Teasdale LLP
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B08B3/04 ; B08B13/00 ; B24B37/04 ; B24B37/08 ; B25J15/06 ; B65G47/91 ; H01L21/02 ; H01L21/67 ; H01L21/687

Abstract:
A semiconductor wafer processing system for processing a set of semiconductor wafers includes a controller, a transfer robot controlled by the controller, a wet bath for containing a cleaning solution, and a cassette positioned in the wet bath for holding the set of wafers. The transfer robot transfers the wafer from a transfer location to the cassette and the controller controls the transfer robot during the transfer.
Public/Granted literature
- US20220028718A1 AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING Public/Granted day:2022-01-27
Information query
IPC分类: