Invention Grant
- Patent Title: Mounting device and mounting method
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Application No.: US17381823Application Date: 2021-07-21
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Publication No.: US12154811B2Publication Date: 2024-11-26
- Inventor: Yasushi Tamura
- Applicant: TORAY ENGINEERING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TORAY ENGINEERING CO., LTD.
- Current Assignee: TORAY ENGINEERING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2019-008997 20190123,JP2019-009086 20190123
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/67 ; H01L23/00 ; H01L23/544

Abstract:
A mounting device and a mounting method is provided with which, after lowering a mounting head holding a chip component in a direction perpendicular to a substrate to bring the chip component into close contact with the substrate subsequent to positioning the chip component and the substrate, a control unit causes a recognition mechanism to start a parallel recognition operation of a chip recognition mark and a substrate recognition mark and recognize the chip recognition mark and the substrate recognition mark through the mounting head in a mounted state in which the chip component is in close contact with the substrate, and calculates mounting position accuracy of the chip component and the substrate.
Public/Granted literature
- US20210351057A1 MOUNTING DEVICE AND MOUNTING METHOD Public/Granted day:2021-11-11
Information query
IPC分类: