Invention Grant
- Patent Title: Method of manufacturing semiconductor devices and semiconductor devices
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Application No.: US17070232Application Date: 2020-10-14
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Publication No.: US12154829B2Publication Date: 2024-11-26
- Inventor: Chandrashekhar Prakash Savant , Chia-Ming Tsai , Tien-Wei Yu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/417 ; H01L29/78 ; H01L29/66

Abstract:
The present disclosure describes method to form a semiconductor device having a gate dielectric layer with controlled doping and to form multiple devices with different Vt. The method includes forming a gate dielectric layer on a fin structure, forming a buffer layer on the gate dielectric layer, and forming a dopant source layer including a dopant on the buffer layer. The gate dielectric layer includes an interfacial layer on the fin structure and a high-k dielectric layer on the interfacial layer. The method further includes doping a portion of the high-k dielectric layer adjacent to the interfacial layer with the dopant, removing the dopant source layer and the buffer layer, forming a dopant pulling layer on the gate dielectric layer, and tuning the dopant in the gate dielectric layer by the dopant pulling layer.
Public/Granted literature
- US20220115521A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES Public/Granted day:2022-04-14
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