A semiconductor device according to the present embodiment comprises a semiconductor chip comprising a first face and a second face on an opposite side to the first face, and comprising a first electrode in the first face. A first metallic member comprises a first opposed face facing the first electrode and being larger in a profile than the first electrode, the first metallic member comprising a first protruded portion protruded from the first opposed face toward the first electrode and electrically connected to the first electrode. An insulating member coats the semiconductor chip and the first metallic member.