Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US17873203Application Date: 2022-07-26
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Publication No.: US12154960B2Publication Date: 2024-11-26
- Inventor: Cheng-Ting Chung , Hou-Yu Chen , Ching-Wei Tsai
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234 ; H01L27/088 ; H01L29/417 ; H01L29/423

Abstract:
A semiconductor device includes a semiconductor layer, a gate structure, a source/drain epitaxial structure, a backside dielectric cap, and an inner spacer. The gate structure wraps around the semiconductor layer. The source/drain epitaxial structure is adjacent the gate structure and electrically connected to the semiconductor layer. The backside dielectric cap is disposed under and in direct contact with the gate structure. The inner spacer is in direct contact with the gate structure and the backside dielectric cap.
Public/Granted literature
- US20220359700A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-11-10
Information query
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