Invention Grant
- Patent Title: Photo sensing device and method of fabricating the photo sensing device
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Application No.: US18365177Application Date: 2023-08-03
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Publication No.: US12154994B2Publication Date: 2024-11-26
- Inventor: Chan-Hong Chern
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: H01L31/028
- IPC: H01L31/028 ; H01L31/0352 ; H01L31/105 ; H01L31/18

Abstract:
The present disclosure provides a photo sensing device and a method of forming the same. The photo sensing device includes a substrate comprising a silicon layer at a front surface of the substrate; a photosensitive member extending into and at least partially surrounded by the silicon layer, and a composite layer disposed between the photosensitive member and the silicon layer and surrounding the photosensitive member. The silicon layer includes a first doped region adjacent to a first side of the photosensitive member and a second doped region adjacent to a second side of the photosensitive member opposite to the first side. The first doped region has a first conductivity type and includes a heavily doped region and a lightly doped region adjacent to the heavily doped region. The second doped region has a second conductivity type different from the first conductivity type.
Public/Granted literature
- US20230378384A1 PHOTO SENSING DEVICE AND METHOD OF FABRICATING THE PHOTO SENSING DEVICE Public/Granted day:2023-11-23
Information query
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