- Patent Title: Method for manufacturing ceramic substrate and ceramic substrate
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Application No.: US17391850Application Date: 2021-08-02
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Publication No.: US12155367B2Publication Date: 2024-11-26
- Inventor: Koki Sai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: ArentFox Schiff LLP
- Priority: JP2019-068267 20190329
- Main IPC: H03H9/05
- IPC: H03H9/05 ; H03H3/02 ; H03H9/02 ; H03H9/10 ; H03H9/19 ; H05K3/00 ; H05K3/12

Abstract:
A method for manufacturing a ceramic substrate that includes forming a mother multilayer body by positioning a hole in at least one ceramic green sheet among a plurality of laminated ceramic green sheets in a location that does not overlap with a recess formation-planned region in which a recess is to be formed after firing of the mother multilayer body and that overlaps with a singulation-planned line for singulating the mother multilayer body into pieces after firing; and forming the recess in the mother multilayer body before firing by performing press working on the recess formation-planned region of the mother multilayer body.
Public/Granted literature
- US20210367578A1 METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE Public/Granted day:2021-11-25
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