Invention Grant
- Patent Title: Backend and acoustic process integration for high-Q filter
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Application No.: US17450847Application Date: 2021-10-14
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Publication No.: US12155373B2Publication Date: 2024-11-26
- Inventor: Kai Liu , Je-Hsiung Lan , Jonghae Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H03H9/54
- IPC: H03H9/54 ; H03H3/02 ; H03H9/05 ; H10N30/071
Abstract:
Disclosed is a radio frequency (RF) filter that vertically integrates an acoustic die with inductors formed in one or more layers above the acoustic die. The acoustic die may be over-molded so that the acoustic dome, important for maintaining acoustic integrity, may be protected.
Public/Granted literature
- US20230121565A1 BACKEND AND ACOUSTIC PROCESS INTEGRATION FOR HIGH-Q FILTER Public/Granted day:2023-04-20
Information query
IPC分类:
