Invention Grant
- Patent Title: Quick release module, fan device having quick release module and electronic device having quick release module
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Application No.: US18054215Application Date: 2022-11-10
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Publication No.: US12156364B2Publication Date: 2024-11-26
- Inventor: Chao Yen Hu , Chin Luang Huang
- Applicant: Wiwynn Corporation
- Applicant Address: TW New Taipei
- Assignee: Wiwynn Corporation
- Current Assignee: Wiwynn Corporation
- Current Assignee Address: TW New Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW111132840 20220831
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H01R13/74

Abstract:
A quick release module includes a support, a first release assembly and a connector. The support has an accommodation hole and a first lateral contact surface located at a periphery of the accommodation hole. The first release assembly includes a first holder. The first holder is slidably disposed on the support, and the first holder is movable towards or away from the first lateral contact surface so as to form an adjustable installation space between the first holder and the first lateral contact surface. The connector is disposed at the adjustable installation space. The connector is fixed by the first lateral contact surface and the first holder, and is removable from the adjustable installation space by sliding the first holder.
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