Invention Grant
- Patent Title: Heat radiation module and electronic device comprising same
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Application No.: US18018010Application Date: 2021-08-05
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Publication No.: US12156386B2Publication Date: 2024-11-26
- Inventor: Sung June Park
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2020-0097955 20200805
- International Application: PCT/KR2021/010358 WO 20210805
- International Announcement: WO2022/031086 WO 20220210
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H02M7/00

Abstract:
A heat radiation module comprises: a bracket having an upper surface, a lower surface, and a first side surface for connecting the upper surface and the lower surface, and a second side surface facing the first side surface; and a heat dissipation passage disposed in the bracket, wherein the bracket includes a groove formed on at least one surface among the upper surface and the lower surface, the heat dissipation passage includes a first passage disposed between one side of the groove and the first side surface and a second passage disposed between the other side of the groove and the second side surface, and a part of the first passage overlaps the groove extending in a direction from the first side surface toward the second side surface.
Public/Granted literature
- US20230284425A1 HEAT RADIATION MODULE AND ELECTRONIC DEVICE COMPRISING SAME Public/Granted day:2023-09-07
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