An electromagnetic wave shielding film having: a base substrate; and an electromagnetic wave shielding layer disposed on the base substrate, where the thickness of the electromagnetic wave shielding layer is 1 nm to 50 nm. In addition, the shielding layer includes: a first layer on the base substrate; a second layer on the first layer; and a third layer on the second layer, wherein the first layer, the second layer, and the third layer include copper sulfide.