Invention Grant
- Patent Title: Cooling apparatus
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Application No.: US17957644Application Date: 2022-09-30
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Publication No.: US12158786B2Publication Date: 2024-12-03
- Inventor: Shui Fa Tsai , Yuan Wu , Wei Ju Lin
- Applicant: COOLER MASTER CO., LTD.
- Applicant Address: TW Taipei
- Assignee: COOLER MASTER CO., LTD.
- Current Assignee: COOLER MASTER CO., LTD.
- Current Assignee Address: TW Taipei
- Agency: Merchant & Gould P.C.
- Priority: CN202210677980.3 20220615
- Main IPC: H01L23/473
- IPC: H01L23/473 ; G06F1/20

Abstract:
A cooling apparatus includes a casing, pumping unit, and heat exchange unit. The pumping unit includes a body and housing. The body includes a wishbone-shaped indentation and lollipop shaped indentation separate from the wishbone-shaped indentation. The housing includes a wishbone-shaped flow path and lollipop-shaped flow path separate from the wishbone-shaped flow path. The body is coupled to the housing such that the wishbone-shaped indentation and the wishbone-shaped flow path define a first flow path and the lollipop-shaped indentation and the lollipop-shaped flow path define a second flow path. The pumping unit is coupled to the heat exchange chamber such that the first flow path and the second flow path is in fluid communication with the heat exchange chamber via a first end opening and second end opening, and third opening, respectively.
Public/Granted literature
- US20230025258A1 COOLING APPARATUS Public/Granted day:2023-01-26
Information query
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