Invention Grant
- Patent Title: Wireless power transfer thin profile coil assembly
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Application No.: US16615290Application Date: 2018-05-30
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Publication No.: US12159745B2Publication Date: 2024-12-03
- Inventor: Bruce Richard Long , Andrew W. Daga , John M. Wolgemuth , Peter C. Schrafel , Benjamin H. Cohen , Moses M. Keener , Francis J. McMahon
- Applicant: Momentum Dynamics Corporation
- Applicant Address: US PA Malvern
- Assignee: Momentum Dynamics Corporation
- Current Assignee: Momentum Dynamics Corporation
- Current Assignee Address: US PA Malvern
- Agency: Culhane Meadows PLLC
- Agent Michael P. Dunnam
- International Application: PCT/US2018/035060 WO 20180530
- International Announcement: WO2018/222669 WO 20181206
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/36 ; H01F27/40 ; H01F38/14 ; H02J50/12 ; H01F27/34

Abstract:
A thin resonant induction wireless power transmission transfer coil assembly designed for low loss and ease of manufacturing includes one or more printed circuit boards having a first conductor pattern wound in a spiral on a first side and a second conductor pattern wound in a spiral on a second side thereof, where the second conductor pattern is aligned with the first conductor pattern whereby the second conductor pattern reinforces magnetic flux generated by the first conductor pattern. The first and second conductor patterns are placed relative to one another so as to provide flux transmission in a same direction. One or more of such printed circuit boards form a wireless power transmission coil assembly with a conductive winding layer, a ferrite flux diversion layer, conformal spacing layers, an eddy current shield layer and an assembly enclosure.
Public/Granted literature
- US20200168393A1 WIRELESS POWER TRANSFER THIN PROFILE COIL ASSEMBLY Public/Granted day:2020-05-28
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