Invention Grant
- Patent Title: Semiconductor device and fabrication method thereof
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Application No.: US16975390Application Date: 2020-07-07
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Publication No.: US12159908B2Publication Date: 2024-12-03
- Inventor: Chao Wang , Ming-Hong Chang
- Applicant: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Applicant Address: CN Zhuhai
- Assignee: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Current Assignee: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Zhuhai
- Agency: JCIPRNET
- International Application: PCT/CN2020/100611 WO 20200707
- International Announcement: WO2022/006731 WO 20220113
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/20 ; H01L29/66 ; H01L29/778

Abstract:
A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a first nitride semiconductor layer, a second nitride semiconductor layer, a gate structure, and a field plate. The second nitride semiconductor layer is formed on a first surface of the first nitride semiconductor layer. The gate structure is disposed on the second nitride semiconductor layer. The field plate includes a first portion and a second portion connected to the first portion. The first portion has a first surface substantially in parallel to the first surface of the first nitride semiconductor layer, and a second surface adjacent to the first surface of the first portion. The first surface of the first portion of the field plate and the second surface of the first portion of the field plate define a first angle of about 90°.
Public/Granted literature
- US20220376058A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2022-11-24
Information query
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