Invention Grant
- Patent Title: Semiconductor structure and fabrication method thereof
-
Application No.: US17645893Application Date: 2021-12-23
-
Publication No.: US12159920B2Publication Date: 2024-12-03
- Inventor: Wufeng Deng
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai; CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN202011553818.8 20201224
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/40

Abstract:
A semiconductor structure and a fabrication method of the semiconductor structure are provided. The semiconductor structure includes a substrate, a gate structure over the substrate, and a sidewall spacer structure located on a sidewall surface of the gate structure. The sidewall spacer structure includes a first sidewall spacer, a second sidewall spacer, and a cavity located between the first sidewall spacer and the second sidewall spacer. The first sidewall spacer is located on the sidewall surface of the gate structure. A top surface of the cavity is above a top surface of the gate structure, and a bottom surface of the cavity is coplanar with a bottom surface of the gate structure. The semiconductor structure also includes a source and drain plug located over the substrate on each side of the gate structure. The source and drain plug is located on a sidewall surface of the second sidewall spacer.
Public/Granted literature
- US20220208987A1 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2022-06-30
Information query
IPC分类: