Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US18359690Application Date: 2023-07-26
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Publication No.: US12159942B2Publication Date: 2024-12-03
- Inventor: Marcus Johannes Henricus Van Dal , Gerben Doornbos , Georgios Vellianitis , Mauricio Manfrini
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66

Abstract:
A semiconductor device includes a channel layer, source/drain contacts, and first barrier liners. The channel layer includes an oxide semiconductor material. The source/drain contacts are disposed in electrical contact with the channel layer. The first barrier liners surround the source/drain contacts, respectively, and include a hydrogen barrier material so as to prevent hydrogen from diffusion through the first barrier liners to the channel layer.
Public/Granted literature
- US20230387327A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-11-30
Information query
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