Invention Grant
- Patent Title: Embeddable semiconductor-based capacitor
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Application No.: US17740412Application Date: 2022-05-10
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Publication No.: US12159945B2Publication Date: 2024-12-03
- Inventor: Cory Nelson , Jeff Borgman
- Applicant: KYOCERA AVX Components Corporation
- Applicant Address: US SC Fountain Inn
- Assignee: KYOCERA AVX Components Corporation
- Current Assignee: KYOCERA AVX Components Corporation
- Current Assignee Address: US SC Fountain Inn
- Agency: Dority & Manning, P.A.
- Main IPC: H01L29/94
- IPC: H01L29/94 ; H01L29/66 ; H05K1/18 ; H05K3/32

Abstract:
A semiconductor-based capacitor can include a substrate including a semiconductor material, an oxide layer formed on a surface of the substrate, a conductive layer formed over at least a portion of the oxide layer, a plurality of distinct coplanar upper terminals, and at least one lower terminal formed. Each of the upper terminals and the at least one lower terminal can be exposed along the top and bottom surfaces of the substrate, respectively, for embedding the capacitor in a substrate such as a circuit board. The semiconductor-based capacitor can be sufficiently miniaturized to be embeddable within a circuit board while providing superior capacitance values. For example, a ratio of the length to the width of the substrate can be in a range from about 3:1 to about 1:3 and an area of the substrate can be less than about 3 mm2.
Public/Granted literature
- US20220367732A1 Embeddable Semiconductor-Based Capacitor Public/Granted day:2022-11-17
Information query
IPC分类: