Invention Grant
- Patent Title: Semiconductor device
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Application No.: US18064757Application Date: 2022-12-12
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Publication No.: US12165741B2Publication Date: 2024-12-10
- Inventor: Take Kyun Woo
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon
- Priority: KR10-2022-0093197 20220727
- Main IPC: G11C8/00
- IPC: G11C8/00 ; G11C5/06 ; G11C8/08 ; G11C11/408 ; G11C11/4097 ; H01L27/105

Abstract:
A semiconductor device may include: a first substrate structure including: a first substrate; a first word line, a first bit line, a second bit line, a second word line, a third word line, a third bit line, a fourth bit line, and a fourth word line that are sequentially arranged over the first substrate in a vertical direction; and first, second, third, and fourth memory cells, the first memory cell being disposed between the first word line and the first bit line, the second memory cell being disposed between the second word line and the second bit line, the third memory cell being disposed between the third word line and the third bit line, and the fourth memory cell being disposed between the fourth word line and the fourth bit line; and a second substrate structure disposed over the first substrate structure and including a second substrate.
Public/Granted literature
- US20240038285A1 SEMICONDUCTOR DEVICE Public/Granted day:2024-02-01
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