Invention Grant
- Patent Title: Substrate support and substrate processing apparatus
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Application No.: US17504523Application Date: 2021-10-19
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Publication No.: US12165854B2Publication Date: 2024-12-10
- Inventor: Nobutaka Sasaki , Shin Matsuura , Gyeong min Park , Toshiki Akama
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP2020-175632 20201019,JP2021-164879 20211006
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683

Abstract:
A substrate support includes a base, a support portion, a first pin member, a second pin member and a driving unit. The base has a first surface on which an object to be supported is placed, a second surface opposite to the first surface, and a first through-hole. The support portion has a third surface in contact with the second surface, a fourth surface opposite to the third surface, and a second through-hole. The first pin member is stored in the first through-hole and a second pin member is stored in the second through-hole. The first through-hole is larger on the second surface side than on the first surface side, and/or the second through-hole is larger on the third surface side than on the fourth surface side.
Public/Granted literature
- US20220122816A1 SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-04-21
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