Invention Grant
- Patent Title: Method of manufacturing conductive lines in a circuit
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Application No.: US17412872Application Date: 2021-08-26
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Publication No.: US12165972B2Publication Date: 2024-12-10
- Inventor: Chung-Hui Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/528
- IPC: H01L23/528 ; G06F30/00 ; G06F30/394 ; H01L21/033 ; H01L21/311 ; H01L21/768 ; H01L27/02 ; H01L27/118

Abstract:
A method includes identifying at least a first mask or a second mask, fabricating, by the first mask, a first conductive line, fabricating, by the second mask, a second conductive line, and fabricating, by the first mask, a third conductive line if a dimension of the first conductive line is larger than a corresponding dimension of the second conductive line, or fabricating, by the second mask, the third conductive line if the dimension of the first conductive line is less than the corresponding dimension of the second conductive line A first circuit element is coupled to a second circuit element by at least the third conductive line, and the first circuit element is separated from the second circuit element by a predetermined distance.
Public/Granted literature
- US20210390217A1 METHOD OF MANUFACTURING CONDUCTIVE LINES IN A CIRCUIT Public/Granted day:2021-12-16
Information query
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