Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US18351149Application Date: 2023-07-12
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Publication No.: US12166069B2Publication Date: 2024-12-10
- Inventor: Zheng-Long Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. , TSMC CHINA COMPANY LIMITED
- Applicant Address: TW Hsinchu; CN Shanghai
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,TSMC CHINA COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,TSMC CHINA COMPANY LIMITED
- Current Assignee Address: TW Hsinchu; CN Shanghai
- Agency: Maschoff Brennan
- Priority: CN202010186664.7 20200317
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/04 ; H01L21/225 ; H01L21/265 ; H01L21/266 ; H01L21/308 ; H01L21/765 ; H01L21/8234 ; H01L29/10 ; H01L29/36 ; H01L29/40 ; H01L29/423 ; H01L29/66 ; H01L29/739 ; H01L29/78 ; H10B63/00

Abstract:
A semiconductor device includes substrate, a first gate structure, a second gate structure, and an epitaxy layer. The first gate structure and the second gate structure are over the substrate, in which the first gate structure and the second gate structure each comprises a shielding electrode, a gate electrode over the shielding electrode, and a first gate dielectric layer vertically separating the shielding electrode from the gate electrode. The epitaxy layer is over the substrate and cups an underside of the first gate structure and the second gate structure, in which the epitaxy layer comprises a doped region laterally between the first gate dielectric layer of the first gate structure and the first gate dielectric layer of the second gate structure, a dopant concentration of the doped region being non-uniform along a lateral direction.
Public/Granted literature
- US20230352305A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-11-02
Information query
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