Invention Grant
- Patent Title: Semiconductor light emitting device and method for manufacturing the same
-
Application No.: US18459763Application Date: 2023-09-01
-
Publication No.: US12166162B2Publication Date: 2024-12-10
- Inventor: Masahiko Kobayakawa , Kazuhiro Mireba , Shintaro Yasuda , Junichi Itai , Taisuke Okada
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: HSML P.C.
- Priority: JP2008-60781 20080311,JP2008-236997 20080916,JP2009-3288 20090109
- Main IPC: H01L23/62
- IPC: H01L23/62 ; H01L23/31 ; H01L23/48 ; H01L23/488 ; H01L23/495 ; H01L25/075 ; H01L33/48 ; H01L33/50 ; H01L33/52 ; H01L33/54 ; H01L33/56 ; H01L33/60 ; H01L33/62 ; H01L33/64 ; H01L25/16
Abstract:
A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
Public/Granted literature
- US20230411581A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-12-21
Information query
IPC分类:
