An electronic assembly includes an interposer assembly and a cable connector module coupled to the interposer assembly. The interposer assembly includes an array of compressible interposer contacts each having upper and lower mating interfaces defining separable mating interfaces. The cable connector module includes a cable connector having a module substrate including module contacts at a bottom of the module substrate coupled to the upper mating interfaces of the corresponding interposer contacts. The cable connector module includes a backshell including a backshell cavity that receives the cable connector. The backshell includes a compression member engaging the cable connector and pressing the cable connector in the direction of the interposer assembly to compress the interposer contacts.