Invention Grant
- Patent Title: Substrate enclosure system with assembly for charging a validation wafer
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Application No.: US18373750Application Date: 2023-09-27
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Publication No.: US12166366B2Publication Date: 2024-12-10
- Inventor: Phillip Alfred Criminale , Zhiqiang Guo , Andrew S. C. Ho , Rachel Sara Stolzman , Michael Carl Hankes
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: LOWENSTEIN SANDLER LLP
- Main IPC: H01M10/44
- IPC: H01M10/44 ; H01M10/46 ; H02J7/00
Abstract:
A system includes an enclosure configured to couple to an equipment front end module (EFEM) of a substrate processing system, a charging assembly, and one or more support structures within the enclosure. The one or more support structures are configured to support a validation wafer in a charging position to charge the validation wafer via the charging assembly.
Public/Granted literature
- US20240022083A1 ENCLOSURE SYSTEM WITH CHARGING ASSEMBLY Public/Granted day:2024-01-18
Information query
