Invention Grant
- Patent Title: Vapor chamber, electronic device, metallic sheet for vapor chamber and manufacturing method of vapor chamber
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Application No.: US16651565Application Date: 2018-09-28
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Publication No.: US12167571B2Publication Date: 2024-12-10
- Inventor: Shinichiro Takahashi , Takayuki Ota , Kiyotaka Takematsu , Kenro Hirata , Taizo Hashimoto , Yoko Nakamura , Kazunori Oda , Toshihiko Takeda , Terutoshi Momose
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo-to
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo-to
- Agency: Oliff PLC
- Priority: JP2017-188534 20170928,JP2017-196065 20171006,JP2017-217593 20171110,JP2017-217633 20171110,JP2018-030999 20180223,JP2018-079326 20180417,JP2018-088848 20180502
- International Application: PCT/JP2018/036261 WO 20180928
- International Announcement: WO2019/065969 WO 20190404
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B32B3/30 ; B32B15/01 ; C23F1/02 ; F28D15/02 ; F28D15/04 ; F28F3/12 ; F28D21/00
Abstract:
A liquid flow path portion of a vapor chamber according to the present invention includes a plurality of main flow grooves which each extend in the first direction and through which working fluid in liquid form passes. A convex array which includes a plurality of liquid flow path convex portions arranged in the first direction via a communicating groove, is provided between a pair of the main flow grooves adjacent to each other. Each of the communicating grooves allows communication between the corresponding pair of the main flow grooves. The width of the communicating groove is larger than the width of the main flow groove.
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