Invention Grant
- Patent Title: Magnetic layer for magnetic random access memory (MRAM) by moment enhancement
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Application No.: US17208303Application Date: 2021-03-22
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Publication No.: US12167699B2Publication Date: 2024-12-10
- Inventor: Guenole Jan , Jodi Mari Iwata , Ru-Ying Tong , Huanlong Liu , Yuan-Jen Lee , Jian Zhu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H10N50/01
- IPC: H10N50/01 ; G11C11/16 ; H01F10/32 ; H10B61/00 ; H10N50/10 ; H10N50/80 ; H10N50/85

Abstract:
A perpendicularly magnetized magnetic tunnel junction (p-MTJ) is disclosed wherein a boron containing free layer (FL) is subjected to a plasma treatment with inert gas, and a natural oxidation (NOX) process to form B2O3 before overlying layers are deposited. A metal layer such as Mg is deposited on the FL as a first step in forming a Hk enhancing layer that increases FL perpendicular magnetic anisotropy, or as a first step in forming a tunnel barrier layer on the FL. One or more anneal steps are essential in assisting B2O3 segregation from the free layer and thereby increasing the FL magnetic moment. A post-oxidation plasma treatment may also be used to partially remove B2O3 proximate to the FL top surface before the metal layer is deposited. Both plasma treatments use low power (
Public/Granted literature
- US20210210680A1 Magnetic Layer for Magnetic Random Access Memory (MRAM) by Moment Enhancement Public/Granted day:2021-07-08
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