Invention Grant
- Patent Title: Method of using fiber to chip coupler and method of making
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Application No.: US18448095Application Date: 2023-08-10
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Publication No.: US12169308B2Publication Date: 2024-12-17
- Inventor: Sui-Ying Hsu , Yuehying Lee , Chien-Ying Wu , Chen-Hao Huang , Chien-Chang Lee , Chia-Ping Lai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G02B6/34
- IPC: G02B6/34 ; G02B6/30 ; G02B6/42

Abstract:
A method of using a coupling system includes aligning an optical fiber with a cavity in a chip, wherein aligning the optical fiber comprises orienting the fiber within an angle ranging from about 88-degrees to about 92-degrees with respect to a top surface of the chip. The method further includes emitting an optical signal from the optical fiber. The method further includes redirecting the optical signal into a waveguide using a grating positioned on an opposite side of the cavity from the optical fiber.
Public/Granted literature
- US20230384528A1 METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING Public/Granted day:2023-11-30
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