Invention Grant
- Patent Title: Integrated circuit with conductive via formation on self-aligned gate metal cut
-
Application No.: US17581787Application Date: 2022-01-21
-
Publication No.: US12170203B2Publication Date: 2024-12-17
- Inventor: Jia-Chuan You , Chia-Hao Chang , Chu-Yuan Hsu , Kuo-Cheng Chiang , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/02 ; H01L21/8234 ; H01L27/088 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
An integrated circuit includes a first nanostructure transistor having a first gate electrode and a second nanostructure transistor having a second gate electrode. A dielectric isolation structure is between the first and second gate electrodes. A gate connection metal is on a portion of the top surface of the first gate electrode and on a portion of a top surface of the second gate electrode. The gate connection metal is patterned to expose other portions of the top surfaces of the first and second gate electrodes adjacent to the dielectric isolation structure. A conductive via contacts the exposed portion of the top surface of the second gate electrode.
Public/Granted literature
- US20230023916A1 INTEGRATED CIRCUIT WITH CONDUCTIVE VIA FORMATION ON SELF-ALIGNED GATE METAL CUT Public/Granted day:2023-01-26
Information query
IPC分类: