Invention Grant
- Patent Title: Transfer device, processing system, and transfer method
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Application No.: US17759117Application Date: 2021-01-13
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Publication No.: US12170216B2Publication Date: 2024-12-17
- Inventor: Shinya Okano
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2020-008497 20200122
- International Application: PCT/JP2021/000816 WO 20210113
- International Announcement: WO2021/149551 WO 20210729
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/687
Abstract:
According to one aspect of the present disclosure, a transfer device has a first holding part configured to contact an edge part of a substrate when holding the substrate, and a second holding part formed with an elastic member and configured to contact only a back surface of the substrate when holding the substrate.
Public/Granted literature
- US20230038276A1 TRANSFER DEVICE, PROCESSING SYSTEM, AND TRANSFER METHOD Public/Granted day:2023-02-09
Information query
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