Invention Grant
- Patent Title: Multilayer capacitor
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Application No.: US17570576Application Date: 2022-01-07
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Publication No.: US12176151B2Publication Date: 2024-12-24
- Inventor: Jeong Wook Seo , Hee Sun Chun , Tae Hyung Kim , Hui Sun Park , Hyeg Soon An , Hyo Ju Lee , Jin Woo Kim , Seok Hyun Yoon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR10-2021-0141711 20211022
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/008 ; H01G4/012 ; H01G4/12

Abstract:
A multilayer capacitor includes a body including a laminate structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer therebetween, and first and second external electrodes spaced apart on the body, to be connected to at least one first internal electrode and at least one second internal electrode, respectively. The body includes, in a larger molar content, at least one selected from the group consisting of Dy, Tb, Y, Sm, Ho, Gd, Er, Ce, La and Nd in a capacitance formation region including a region between at least one first internal electrode and at least one second internal electrode than in a margin region including a region between a boundary line of at least one first internal electrode and at least one second internal electrode and a surface of the body.
Public/Granted literature
- US20230130377A1 MULTILAYER CAPACITOR Public/Granted day:2023-04-27
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