Invention Grant
- Patent Title: Methods of parallel transfer of micro-devices using treatment
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Application No.: US18450963Application Date: 2023-08-16
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Publication No.: US12176384B2Publication Date: 2024-12-24
- Inventor: Manivannan Thothadri , Arvinder Chadha
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L21/67 ; H01L21/683 ; H01L25/075 ; H01L33/00 ; H01L33/60 ; H05K3/00 ; H05K3/30 ; H05K13/00 ; H05K13/04 ; H01L33/20 ; H01L33/48
Abstract:
A method of transferring micro-devices includes selectively treating a first adhesive layer to form a treated portion and an untreated portion while micro-devices are attached the first adhesive layer. A second adhesive layer on a second surface is placed to abut the micro-devices. The first adhesive layer is exposed to illumination in a region that overlaps at least some of the treated portion and at least some of the untreated portion. Exposing the first adhesive layer to illumination neutralizes the at least some of the untreated portion to create a neutralized portion that is less adhesive than an exposed area of the treated portion. The first surface is separated from the second surface such that micro-devices in the treated portion remain attached to the first surface and micro-devices in the neutralized portion are attached to the second surface and separate from the first surface.
Public/Granted literature
- US20230395645A1 METHODS OF PARALLEL TRANSFER OF MICRO-DEVICES USING TREATMENT Public/Granted day:2023-12-07
Information query
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