Invention Grant
- Patent Title: Light emitting device and manufacturing method thereof
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Application No.: US18200356Application Date: 2023-05-22
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Publication No.: US12176458B2Publication Date: 2024-12-24
- Inventor: Dae Hong Min , Jun Ho Yoon , Woo Cheol Gwak , Jin Woo Huh , Yong Hyun Baek
- Applicant: SEOUL VIOSYS CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: LaBatt, LLC
- Priority: KR10-2018-0079626 20180709,KR10-2018-0119585 20181008,KR10-2018-0122759 20181015
- Main IPC: H01L33/10
- IPC: H01L33/10 ; H01L33/22

Abstract:
A light emitting device includes a substrate; a pattern of a plurality of protrusions protruding from the substrate; a first semiconductor layer provided on the substrate; an active layer provided on the first semiconductor layer; and a second semiconductor layer provided on the active layer, in which each of the protrusions includes a first layer formed integrally with the substrate and protruding from an upper surface of the base substrate; and a second layer provided on the first layer and formed of a material different from that of the first layer.
Public/Granted literature
- US20230378394A1 LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-11-23
Information query
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