Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17582990Application Date: 2022-01-24
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Publication No.: US12183782B2Publication Date: 2024-12-31
- Inventor: Takako Motai , Tomoko Matsudai , Yoko Iwakaji , Hiroko Itokazu , Kaori Fuse , Keiko Kawamura , Kohei Oasa
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2021-150262 20210915
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/739

Abstract:
A semiconductor device includes a semiconductor part, first and second electrodes and a control electrode. The semiconductor part is provided between the first and second electrode. The semiconductor part includes first and third layers of a first conductivity type, and second, fourth and fifth layers of a second conductivity type. The first layer extends between the first and second electrodes. The second layer is provided between the first layer and the second electrode. The third semiconductor layer is provided between the second layer and the second electrode. The fourth layer is provided between the first layer and the first electrode. The semiconductor part includes an active region and a termination region. The active region includes the control electrode, the second layer, and the third layer. The termination region surrounds the active region. The fifth layer is provided in the first layer in the termination region.
Public/Granted literature
- US20230078785A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-03-16
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