Invention Grant
- Patent Title: Semiconductor device structure and methods of forming the same
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Application No.: US18229465Application Date: 2023-08-02
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Publication No.: US12183790B2Publication Date: 2024-12-31
- Inventor: Shahaji B. More
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: NZ CARR LAW OFFICE
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
A semiconductor device structure, along with methods of forming such, are described. The structure includes a source/drain epitaxial feature having a first semiconductor material, a first semiconductor layer having a first doped region and a first undoped region adjacent the first doped region, and the first doped region is in contact with the first semiconductor material. The structure further includes a second semiconductor layer disposed over the first semiconductor layer, and the second semiconductor layer includes a second doped region and a second undoped region adjacent the second doped region. The second doped region is in contact with the first semiconductor material. The structure further includes a gate electrode layer surrounding at least the first undoped region and the second undoped region.
Public/Granted literature
- US20230378269A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME Public/Granted day:2023-11-23
Information query
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